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Metal barrier induced damage in self-assembly based organosilica low-k dielectrics and its reduction by organic template residues

dc.contributor.authorKrishtab, Mikhail
dc.contributor.authorde Marneffe, Jean-Francois
dc.contributor.authorArmini, Silvia
dc.contributor.authorMeersschaut, Johan
dc.contributor.authorBender, Hugo
dc.contributor.authorWilson, Chris
dc.contributor.authorDe Gendt, Stefan
dc.date.accessioned2021-10-27T11:47:48Z
dc.date.available2021-10-27T11:47:48Z
dc.date.issued2019
dc.identifier.issn0169-4332
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/33334
dc.sourceIIOimport
dc.titleMetal barrier induced damage in self-assembly based organosilica low-k dielectrics and its reduction by organic template residues
dc.typeJournal article
dc.contributor.imecauthorKrishtab, Mikhail
dc.contributor.imecauthorde Marneffe, Jean-Francois
dc.contributor.imecauthorArmini, Silvia
dc.contributor.imecauthorMeersschaut, Johan
dc.contributor.imecauthorBender, Hugo
dc.contributor.imecauthorWilson, Chris
dc.contributor.imecauthorDe Gendt, Stefan
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.contributor.orcidimecMeersschaut, Johan::0000-0003-2467-1784
dc.contributor.orcidimecDe Gendt, Stefan::0000-0003-3775-3578
dc.source.peerreviewyes
dc.source.beginpage170
dc.source.endpage178
dc.source.journalApplied Surface Science
dc.source.volume485
dc.identifier.urlhttps://doi.org/10.1016/j.apsusc.2019.04.083
imec.availabilityPublished - imec


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