Show simple item record

In-line metrology for characterization and control of extreme wafer thinning of bonded wafers

dc.contributor.authorLiebens, Maarten
dc.contributor.authorJourdain, Anne
dc.contributor.authorDe Vos, Joeri
dc.contributor.authorVandeweyer, Tom
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyne, Eric
dc.contributor.authorLi, Shifang
dc.contributor.authorBast, Gerard
dc.contributor.authorStoerring, Moritz
dc.contributor.authorHiebert, Stephen
dc.contributor.authorCross, Andrew
dc.date.accessioned2021-10-27T12:43:35Z
dc.date.available2021-10-27T12:43:35Z
dc.date.issued2019
dc.identifier.issn0894-6507
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/33448
dc.sourceIIOimport
dc.titleIn-line metrology for characterization and control of extreme wafer thinning of bonded wafers
dc.typeJournal article
dc.contributor.imecauthorLiebens, Maarten
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorDe Vos, Joeri
dc.contributor.imecauthorVandeweyer, Tom
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorStoerring, Moritz
dc.contributor.imecauthorCross, Andrew
dc.contributor.orcidimecDe Vos, Joeri::0000-0002-9332-9336
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage54
dc.source.endpage61
dc.source.journalIEEE Transactions on Semiconductor Manufacturing
dc.source.issue1
dc.source.volume32
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8572790
imec.availabilityPublished - open access


Files in this item

Thumbnail
Name:
39664.pdf
Size:
1.811Mb
Format:
PDF
View/open

This item appears in the following collection(s)

Show simple item record