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Study of out-of-plane mechanical stress impact on Si BJT and diffusion resistor using in-situ nanoindentation probing

dc.contributor.authorLiu, Yefan
dc.contributor.authorHiblot, Gaspard
dc.contributor.authorFuruhashi, Takahisa
dc.contributor.authorLin, Hesheng
dc.contributor.authorVelenis, Dimitrios
dc.contributor.authorDe Wolf, Ingrid
dc.date.accessioned2021-10-27T12:50:23Z
dc.date.available2021-10-27T12:50:23Z
dc.date.issued2019
dc.identifier.issn0026-2714
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/33461
dc.sourceIIOimport
dc.titleStudy of out-of-plane mechanical stress impact on Si BJT and diffusion resistor using in-situ nanoindentation probing
dc.typeJournal article
dc.contributor.imecauthorLiu, Yefan
dc.contributor.imecauthorHiblot, Gaspard
dc.contributor.imecauthorFuruhashi, Takahisa
dc.contributor.imecauthorLin, Hesheng
dc.contributor.imecauthorVelenis, Dimitrios
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecHiblot, Gaspard::0000-0002-3869-965X
dc.contributor.orcidimecLin, Hesheng::0000-0002-7404-3156
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.source.peerreviewyes
dc.source.beginpage113367
dc.source.journalMicroelectronics Reliability
dc.source.volume100-101
dc.identifier.urlhttps://doi.org/10.1016/j.microrel.2019.06.059
imec.availabilityPublished - imec
imec.internalnotesSpecial issue ESREF 2019


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