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Thermal management and processing optimization for 3D multi-layer stacked IC's

dc.contributor.authorLofrano, Melina
dc.contributor.authorCherman, Vladimir
dc.contributor.authorGerets, Carine
dc.contributor.authorBex, Pieter
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-27T12:53:26Z
dc.date.available2021-10-27T12:53:26Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/33467
dc.sourceIIOimport
dc.titleThermal management and processing optimization for 3D multi-layer stacked IC's
dc.typeProceedings paper
dc.contributor.imecauthorLofrano, Melina
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorGerets, Carine
dc.contributor.imecauthorBex, Pieter
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBex, Pieter::0000-0003-0896-2514
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecCherman, Vladimir::0000-0002-8068-9236
dc.source.peerreviewyes
dc.source.beginpage1
dc.source.endpage4
dc.source.conference25th International Workshop Thermal Investigations of ICs and Systems - Therminic2019
dc.source.conferencedate25/09/2019
dc.source.conferencelocationLecco Italt
imec.availabilityPublished - imec


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