Pre-Bond Testing Through Direct Probing of Large-Array Fine-Pitch Micro-Bumps

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Authors
Marinissen, Erik Jan; De Wachter, Bart; Kiesewetter, Joerg; Smith, Ken
Book
Handbook of 3D Integration - Volume 4: 3D Design, Test, and Thermal Management
Title
Pre-Bond Testing Through Direct Probing of Large-Array Fine-Pitch Micro-Bumps
Publication type
Book chapter
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