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Pre-Bond Testing Through Direct Probing of Large-Array Fine-Pitch Micro-Bumps

dc.contributor.authorMarinissen, Erik Jan
dc.contributor.authorDe Wachter, Bart
dc.contributor.authorKiesewetter, Joerg
dc.contributor.authorSmith, Ken
dc.date.accessioned2021-10-27T13:33:02Z
dc.date.available2021-10-27T13:33:02Z
dc.date.issued2019-03
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/33540
dc.sourceIIOimport
dc.titlePre-Bond Testing Through Direct Probing of Large-Array Fine-Pitch Micro-Bumps
dc.typeBook chapter
dc.contributor.imecauthorMarinissen, Erik Jan
dc.contributor.imecauthorDe Wachter, Bart
dc.contributor.orcidimecMarinissen, Erik Jan::0000-0002-5058-8303
dc.source.peerreviewyes
dc.source.beginpage231
dc.source.bookHandbook of 3D Integration - Volume 4: 3D Design, Test, and Thermal Management
dc.source.endpage252
dc.identifier.urlhttps://doi.org/10.1002/9783527697052.ch11
imec.availabilityPublished - imec


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