dc.contributor.author | Mukundhan, Priya | |
dc.contributor.author | Hou, Lin | |
dc.contributor.author | Derakhshandeh, Jaber | |
dc.contributor.author | Liebens, Maarten | |
dc.date.accessioned | 2021-10-27T14:25:28Z | |
dc.date.available | 2021-10-27T14:25:28Z | |
dc.date.issued | 2019 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/33632 | |
dc.source | IIOimport | |
dc.title | Non-destructive in-line IMC thickness measurement using acoustic metrology | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Hou, Lin | |
dc.contributor.imecauthor | Derakhshandeh, Jaber | |
dc.contributor.imecauthor | Liebens, Maarten | |
dc.contributor.orcidimec | Derakhshandeh, Jaber::0000-0003-2448-9165 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 274 | |
dc.source.endpage | 279 | |
dc.source.conference | International Symposium on Microelectronics: Fall 2019 | |
dc.source.conferencedate | 1/10/2019 | |
dc.source.conferencelocation | Boston, MA USA | |
dc.identifier.url | https://doi.org/10.4071/2380-4505-2019.1.000274 | |
imec.availability | Published - imec | |