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Thermal cycling life testing of Plated Through Hole vias in PCBs

dc.contributor.authorNawghane, Chinmay
dc.contributor.authorVandevelde, Bart
dc.contributor.authorCauwe, Maarten
dc.date.accessioned2021-10-27T14:37:05Z
dc.date.available2021-10-27T14:37:05Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/33652
dc.sourceIIOimport
dc.titleThermal cycling life testing of Plated Through Hole vias in PCBs
dc.typeProceedings paper
dc.contributor.imecauthorNawghane, Chinmay
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorCauwe, Maarten
dc.contributor.orcidimecNawghane, Chinmay::0000-0002-1867-827X
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecCauwe, Maarten::0000-0002-6413-998X
dc.source.peerreviewno
dc.source.conferenceEMPS Workshop (ESA)
dc.source.conferencedate15/05/2019
dc.source.conferencelocationParis France
imec.availabilityPublished - imec


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