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Thermal analysis of a 3D flip-chip fan-out wafer level package (fcFOWLP) for high bandwidth 3D integration

dc.contributor.authorOprins, Herman
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-27T15:08:07Z
dc.date.available2021-10-27T15:08:07Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/33705
dc.sourceIIOimport
dc.titleThermal analysis of a 3D flip-chip fan-out wafer level package (fcFOWLP) for high bandwidth 3D integration
dc.typeProceedings paper
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage1234
dc.source.endpage1242
dc.source.conference2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
dc.source.conferencedate28/05/2019
dc.source.conferencelocationLas vegas, NV USA
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8757368
imec.availabilityPublished - open access


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