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Thermal modeling and experimental model validation for 3D stacked ICs

dc.contributor.authorOprins, Herman
dc.contributor.authorMaggioni, Federica
dc.contributor.authorCherman, Vladimir
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-27T15:08:42Z
dc.date.available2021-10-27T15:08:42Z
dc.date.issued2019-04
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/33706
dc.sourceIIOimport
dc.titleThermal modeling and experimental model validation for 3D stacked ICs
dc.typeBook chapter
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.beginpage413
dc.source.bookHandbook of 3D Integration - Vol. 4
dc.source.endpage432
dc.identifier.urlhttps://www.wiley.com/en-be/Handbook+of+3D+Integration%3A+Volume+4%3A+Design%2C+Test%2C+and+Thermal+Management-p-9783527338559
imec.availabilityPublished - imec
imec.internalnoteschapter 18


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