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A high-bandwidth fine-pitch 2.57Tbps/mm in-package communication link achieving 48fJ/bit/mm efficiency

dc.contributor.authorPantano, Nicolas
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorBex, Pieter
dc.contributor.authorNolmans, Philip
dc.contributor.authorVelenis, Dimitrios
dc.contributor.authorVerhelst, Marian
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-27T15:25:21Z
dc.date.available2021-10-27T15:25:21Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/33734
dc.sourceIIOimport
dc.titleA high-bandwidth fine-pitch 2.57Tbps/mm in-package communication link achieving 48fJ/bit/mm efficiency
dc.typeProceedings paper
dc.contributor.imecauthorPantano, Nicolas
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorBex, Pieter
dc.contributor.imecauthorNolmans, Philip
dc.contributor.imecauthorVelenis, Dimitrios
dc.contributor.imecauthorVerhelst, Marian
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecBex, Pieter::0000-0003-0896-2514
dc.contributor.orcidimecVerhelst, Marian::0000-0003-3495-9263
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.beginpage607
dc.source.endpage613
dc.source.conference2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
dc.source.conferencedate28/05/2019
dc.source.conferencelocationLas Vegas, NV USA
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8811132
imec.availabilityPublished - imec


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