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Downscaling area-selective deposition to sub-30 nm half-pitch lines

dc.contributor.authorPasquali, Mattia
dc.contributor.authorMurdoch, Gayle
dc.contributor.authorTokei, Zsolt
dc.contributor.authorDe Gendt, Stefan
dc.contributor.authorArmini, Silvia
dc.date.accessioned2021-10-27T15:36:35Z
dc.date.available2021-10-27T15:36:35Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/33753
dc.sourceIIOimport
dc.titleDownscaling area-selective deposition to sub-30 nm half-pitch lines
dc.typeMeeting abstract
dc.contributor.imecauthorPasquali, Mattia
dc.contributor.imecauthorMurdoch, Gayle
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorDe Gendt, Stefan
dc.contributor.imecauthorArmini, Silvia
dc.contributor.orcidimecPasquali, Mattia::0000-0002-1309-1082
dc.contributor.orcidimecDe Gendt, Stefan::0000-0003-3775-3578
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.source.peerreviewyes
dc.source.beginpage6.3
dc.source.conferenceIEEE International Interconnect Technology Conference (IITC 2019) and Materials for Advanced Metallization Conference (MAM 2019)
dc.source.conferencedate3/06/2019
dc.source.conferencelocationBrussels Belgium
dc.identifier.urlhttps://iitc-conference.org/2019-iitc-mam-program/
imec.availabilityPublished - imec


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