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Enabling ultra-thin die to wafer hybrid bonding for future heterogeneous integrated systems

dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorSuhard, Samuel
dc.contributor.authorBex, Pieter
dc.contributor.authorIacovo, Serena
dc.contributor.authorSlabbekoorn, John
dc.contributor.authorInoue, Fumihiro
dc.contributor.authorPeng, Lan
dc.contributor.authorKennes, Koen
dc.contributor.authorSleeckx, Erik
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-27T16:03:19Z
dc.date.available2021-10-27T16:03:19Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/33796
dc.sourceIIOimport
dc.titleEnabling ultra-thin die to wafer hybrid bonding for future heterogeneous integrated systems
dc.typeMeeting abstract
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorSuhard, Samuel
dc.contributor.imecauthorBex, Pieter
dc.contributor.imecauthorIacovo, Serena
dc.contributor.imecauthorSlabbekoorn, John
dc.contributor.imecauthorInoue, Fumihiro
dc.contributor.imecauthorPeng, Lan
dc.contributor.imecauthorKennes, Koen
dc.contributor.imecauthorSleeckx, Erik
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBex, Pieter::0000-0003-0896-2514
dc.contributor.orcidimecIacovo, Serena::0000-0002-0826-9165
dc.contributor.orcidimecPeng, Lan::0000-0003-1824-126X
dc.contributor.orcidimecSleeckx, Erik::0000-0003-2560-6132
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.beginpage607
dc.source.endpage613
dc.source.conference2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
dc.source.conferencedate28/05/2019
dc.source.conferencelocationLas Vegas, NV USA
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8811420
imec.availabilityPublished - imec


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