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Stretchable mould interconnect optimization: peeling automation and carrierless techniques

dc.contributor.authorPlovie, Bart
dc.contributor.authorYang, Yang
dc.contributor.authorDunphy, Sheila
dc.contributor.authorDhaenens, Kristof
dc.contributor.authorVan Put, Steven
dc.contributor.authorBossuyt, Frederick
dc.contributor.authorVanfleteren, Jan
dc.date.accessioned2021-10-27T16:11:50Z
dc.date.available2021-10-27T16:11:50Z
dc.date.issued2019
dc.identifier.issn2156-3950
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/33810
dc.sourceIIOimport
dc.titleStretchable mould interconnect optimization: peeling automation and carrierless techniques
dc.typeJournal article
dc.contributor.imecauthorDunphy, Sheila
dc.contributor.imecauthorDhaenens, Kristof
dc.contributor.imecauthorVan Put, Steven
dc.contributor.imecauthorBossuyt, Frederick
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.orcidimecBossuyt, Frederick::0000-0003-3350-9295
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage955
dc.source.endpage962
dc.source.journalIEEE Transactions on Components, Packaging and Manufacturing Technology
dc.source.issue5
dc.source.volume9
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8672081
imec.availabilityPublished - open access


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