Stretchable mould interconnect optimization: peeling automation and carrierless techniques

Thumbnail
View/open
Metadata
Show full item record
Authors
Plovie, Bart; Yang, Yang; Dunphy, Sheila; Dhaenens, Kristof; Van Put, Steven; Bossuyt, Frederick; Vanfleteren, Jan
ISSN
2156-3950
Issue
5
Journal
IEEE Transactions on Components, Packaging and Manufacturing Technology
Volume
9
Title
Stretchable mould interconnect optimization: peeling automation and carrierless techniques
Publication type
Journal article
Embargo date
9999-12-31
Collections