Publication:

Stretchable mould interconnect optimization: peeling automation and carrierless techniques

Date

2019
Journal article
Simple item page Full metadata Statistics
 
dc.contributor.authorPlovie, Bart
dc.contributor.authorYang, Yang
dc.contributor.authorDunphy, Sheila
dc.contributor.authorDhaenens, Kristof
dc.contributor.authorVan Put, Steven
dc.contributor.authorBossuyt, Frederick
dc.contributor.authorVanfleteren, Jan
dc.contributor.imecauthorDunphy, Sheila
dc.contributor.imecauthorDhaenens, Kristof
dc.contributor.imecauthorVan Put, Steven
dc.contributor.imecauthorBossuyt, Frederick
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.orcidimecBossuyt, Frederick::0000-0003-3350-9295
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.date.accessioned2021-10-27T16:11:50Z
dc.date.available2021-10-27T16:11:50Z
dc.date.embargo9999-12-31
dc.date.issued2019
dc.identifier.issn2156-3950
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/33810
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8672081
dc.source.beginpage955
dc.source.endpage962
dc.source.issue5
dc.source.journalIEEE Transactions on Components, Packaging and Manufacturing Technology
dc.source.volume9
dc.title

Stretchable mould interconnect optimization: peeling automation and carrierless techniques

dc.typeJournal article
dspace.entity.typePublication
Files

Original bundle

Name:
43319.pdf
Size:
3.24 MB
Format:
Adobe Portable Document Format
Download
Publication available in collections:
Articles