Publication:

Stretchable mould interconnect optimization: peeling automation and carrierless techniques

Date

2019
Journal article
Simple item page Full metadata Statistics
Loading...
Thumbnail Image

Files

43319.pdf 3.24 MB

Author(s)

Plovie, Bart
;
Yang, Yang
;
Dunphy, Sheila  
;
Dhaenens, Kristof  
;
Van Put, Steven  
;
Bossuyt, Frederick  
;
Vanfleteren, Jan  

Journal

IEEE Transactions on Components, Packaging and Manufacturing Technology

Abstract

Description

Metrics

Views

1927 since deposited on 2021-10-27
1last month
Acq. date: 2025-12-13

Citations

Metrics

Views

1927 since deposited on 2021-10-27
1last month
Acq. date: 2025-12-13

Citations