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Three-tiered risk assessment for engineered nanomaterials. A use case for the semiconductor industry

dc.contributor.authorProdanov, Dimiter
dc.contributor.authorBelde, P.
dc.contributor.authorGeerts, L.
dc.contributor.authorL'Allain, C.
dc.contributor.authorLe Feber, M.
dc.contributor.authorMoclair, F.
dc.contributor.authorMorelli, A.
dc.contributor.authorRoquet, P.
dc.date.accessioned2021-10-27T16:24:36Z
dc.date.available2021-10-27T16:24:36Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/33829
dc.sourceIIOimport
dc.titleThree-tiered risk assessment for engineered nanomaterials. A use case for the semiconductor industry
dc.typeProceedings paper
dc.contributor.imecauthorProdanov, Dimiter
dc.contributor.orcidimecProdanov, Dimiter::0000-0001-8694-0535
dc.source.peerreviewyes
dc.source.beginpage12010
dc.source.conference6th NanoSAFE International Conference 2018
dc.source.conferencedate5/11/2018
dc.source.conferencelocationGrenoble France
dc.identifier.urlhttps://iopscience.iop.org/article/10.1088/1742-6596/1323/1/012010/pdf
imec.availabilityPublished - imec
imec.internalnotesInstitute of Physics. Conference Proceedings; Vol. 1323


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