dc.contributor.author | Schubert, G. | |
dc.contributor.author | Beaucarne, Guy | |
dc.contributor.author | Tous, Loic | |
dc.contributor.author | Hoornstra, J. | |
dc.date.accessioned | 2021-10-27T17:45:51Z | |
dc.date.available | 2021-10-27T17:45:51Z | |
dc.date.issued | 2019 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/33955 | |
dc.source | IIOimport | |
dc.title | Trends in metallization and interconnection – Results of the survey conducted during the 8th Metallization and Interconnection Workshop | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Tous, Loic | |
dc.contributor.orcidimec | Tous, Loic::0000-0001-9928-7774 | |
dc.date.embargo | 9999-12-31 | |
dc.source.peerreview | no | |
dc.source.beginpage | 20002 | |
dc.source.conference | Proceedings of the 8th Workshop on Metallization and Interconnection for Crystalline Silicon Solar Cells | |
dc.source.conferencedate | 13/05/2019 | |
dc.source.conferencelocation | Konstanz Germany | |
dc.identifier.url | https://doi.org/10.1063/1.5125867 | |
imec.availability | Published - imec | |
imec.internalnotes | AIP Conference Proceedings; Vol. 2156 | |