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Design enablement of fine pitch face-to-face 3D system integration using die-by-die place & route

dc.contributor.authorSisto, Giuliano
dc.contributor.authorChou, Richard
dc.contributor.authorMilojevic, Dragomir
dc.contributor.editorDebacker, Peter
dc.contributor.editorChen, Rongmei
dc.contributor.editorVan der Plas, Geert
dc.contributor.editorBeyne, Eric
dc.date.accessioned2021-10-27T18:30:20Z
dc.date.available2021-10-27T18:30:20Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/34021
dc.sourceIIOimport
dc.titleDesign enablement of fine pitch face-to-face 3D system integration using die-by-die place & route
dc.typeProceedings paper
dc.contributor.imecauthorSisto, Giuliano
dc.contributor.imecauthorMilojevic, Dragomir
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage1
dc.source.endpage4
dc.source.conference2019 International 3D Systems Integration Conference - 3DIC
dc.source.conferencedate8/10/2019
dc.source.conferencelocationSendai Japan
dc.identifier.urlhttps://ieeexplore.ieee.org/document/9058901
imec.availabilityPublished - open access


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