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Cost modeling for 2.5D and 3D stacked ICs

dc.contributor.authorTaouil, Mottaqiallah
dc.contributor.authorHamdioui, Said
dc.contributor.authorMarinissen, Erik Jan
dc.date.accessioned2021-10-27T19:30:44Z
dc.date.available2021-10-27T19:30:44Z
dc.date.issued2019-03
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/34110
dc.sourceIIOimport
dc.titleCost modeling for 2.5D and 3D stacked ICs
dc.typeBook chapter
dc.contributor.imecauthorMarinissen, Erik Jan
dc.contributor.orcidimecMarinissen, Erik Jan::0000-0002-5058-8303
dc.source.peerreviewyes
dc.source.beginpage189
dc.source.bookHandbook of 3D Integration - Volume 4: 3D Design, Test, and Thermal Management
dc.source.endpage207
dc.identifier.urlhttps://onlinelibrary.wiley.com/doi/abs/10.1002/9783527697052.ch9
imec.availabilityPublished - imec


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