Cost modeling for 2.5D and 3D stacked ICs

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Authors
Taouil, Mottaqiallah; Hamdioui, Said; Marinissen, Erik Jan
Book
Handbook of 3D Integration - Volume 4: 3D Design, Test, and Thermal Management
Title
Cost modeling for 2.5D and 3D stacked ICs
Publication type
Book chapter
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