Publication:
Cost modeling for 2.5D and 3D stacked ICs
Date
| dc.contributor.author | Taouil, Mottaqiallah | |
| dc.contributor.author | Hamdioui, Said | |
| dc.contributor.author | Marinissen, Erik Jan | |
| dc.contributor.imecauthor | Marinissen, Erik Jan | |
| dc.contributor.orcidimec | Marinissen, Erik Jan::0000-0002-5058-8303 | |
| dc.date.accessioned | 2021-10-27T19:30:44Z | |
| dc.date.available | 2021-10-27T19:30:44Z | |
| dc.date.issued | 2019-03 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/34110 | |
| dc.identifier.url | https://onlinelibrary.wiley.com/doi/abs/10.1002/9783527697052.ch9 | |
| dc.source.beginpage | 189 | |
| dc.source.book | Handbook of 3D Integration - Volume 4: 3D Design, Test, and Thermal Management | |
| dc.source.endpage | 207 | |
| dc.title | Cost modeling for 2.5D and 3D stacked ICs | |
| dc.type | Book chapter | |
| dspace.entity.type | Publication | |
| Files | ||
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