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Dynamics of electromigration induced void-hillock growth and precipitation/dissolution of addition elements studied by in-situ electron microscopy resistance measurements

dc.contributor.authorD'Haen, Jan
dc.contributor.authorCosemans, P.
dc.contributor.authorManca, Jean
dc.contributor.authorLekens, Geert
dc.contributor.authorMartens, T.
dc.contributor.authorDe Ceuninck, Ward
dc.contributor.authorD'Olieslaeger, Marc
dc.contributor.authorDe Schepper, Luc
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-06T11:04:41Z
dc.date.available2021-10-06T11:04:41Z
dc.date.issued1999
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/3420
dc.sourceIIOimport
dc.titleDynamics of electromigration induced void-hillock growth and precipitation/dissolution of addition elements studied by in-situ electron microscopy resistance measurements
dc.typeJournal article
dc.contributor.imecauthorD'Haen, Jan
dc.contributor.imecauthorLekens, Geert
dc.contributor.imecauthorDe Ceuninck, Ward
dc.contributor.imecauthorD'Olieslaeger, Marc
dc.contributor.imecauthorMaex, Karen
dc.source.peerreviewno
dc.source.beginpage1617
dc.source.endpage1630
dc.source.journalMicroelectronics and Reliability
dc.source.issue11
dc.source.volume39
imec.availabilityPublished - imec


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