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dc.contributor.authorVan Dyck, Rik
dc.contributor.authorBorgers, Tom
dc.contributor.authorGovaerts, Jonathan
dc.contributor.authorVoroshazi, Eszter
dc.contributor.authorVan Vuure, Aart Willem
dc.contributor.authorPoortmans, Jef
dc.date.accessioned2021-10-27T20:43:10Z
dc.date.available2021-10-27T20:43:10Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/34214
dc.sourceIIOimport
dc.titleWoven multi-ribbon interconnection for back-contact cells: extending the functionality of the encapsulant
dc.typeProceedings paper
dc.contributor.imecauthorVan Dyck, Rik
dc.contributor.imecauthorBorgers, Tom
dc.contributor.imecauthorGovaerts, Jonathan
dc.contributor.imecauthorVoroshazi, Eszter
dc.contributor.imecauthorPoortmans, Jef
dc.contributor.orcidimecVan Dyck, Rik::0000-0003-3947-4361
dc.contributor.orcidimecBorgers, Tom::0000-0002-7878-6977
dc.contributor.orcidimecGovaerts, Jonathan::0000-0002-8908-1198
dc.contributor.orcidimecPoortmans, Jef::0000-0003-2077-2545
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage80002
dc.source.conferenceSilicon PV 2019 - 9th International Conference on Crystalline Silicon Photovoltaics
dc.source.conferencedate7/04/2019
dc.source.conferencelocationLeuven Belgium
dc.identifier.urlhttps://doi.org/10.1063/1.5123868
imec.availabilityPublished - open access
imec.internalnotesAIP Conference Proceedings; Vol. 2147


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