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dc.contributor.authorDonaton, R. A.
dc.contributor.authorCoenegrachts, Bart
dc.contributor.authorMaex, Karen
dc.contributor.authorStruyf, Herbert
dc.contributor.authorVanhaelemeersch, Serge
dc.contributor.authorBeyer, Gerald
dc.contributor.authorRichard, Emmanuel
dc.contributor.authorVervoort, Iwan
dc.contributor.authorFyen, Wim
dc.contributor.authorGrillaert, Joost
dc.contributor.authorvan der Groen, Sonja
dc.contributor.authorStucchi, Michele
dc.contributor.authorDe Roest, David
dc.date.accessioned2021-10-06T11:06:00Z
dc.date.available2021-10-06T11:06:00Z
dc.date.issued1999
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/3428
dc.sourceIIOimport
dc.titleCritical issues in the integration of Copper and low-k dielectrics
dc.typeProceedings paper
dc.contributor.imecauthorCoenegrachts, Bart
dc.contributor.imecauthorMaex, Karen
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.imecauthorVanhaelemeersch, Serge
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorStucchi, Michele
dc.contributor.imecauthorDe Roest, David
dc.contributor.orcidimecVanhaelemeersch, Serge::0000-0003-2102-7395
dc.source.peerreviewno
dc.source.beginpage262
dc.source.endpage264
dc.source.conferenceProceedings of the International Interconnect Technology Conference - IITC; San Francisco, CA, USA.
imec.availabilityPublished - imec


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