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How to deal with chip-package, package-board and board-system interactions for future electronic systems reliability

dc.contributor.authorVandevelde, Bart
dc.date.accessioned2021-10-27T21:45:25Z
dc.date.available2021-10-27T21:45:25Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/34303
dc.sourceIIOimport
dc.titleHow to deal with chip-package, package-board and board-system interactions for future electronic systems reliability
dc.typeOral presentation
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.source.peerreviewno
dc.source.conferenceTrends and Challenges in Reliability: from components to systems
dc.source.conferencedate9/05/2019
dc.source.conferencelocationEindhoven Nederland
imec.availabilityPublished - imec


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