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Buried metal line compatible with 3D sequential integration for top tier planar devices dynamic Vth tuning and RF shielding applications

dc.contributor.authorVandooren, Anne
dc.contributor.authorWu, Zhicheng
dc.contributor.authorKhaled, Ahmad
dc.contributor.authorFranco, Jacopo
dc.contributor.authorParvais, Bertrand
dc.contributor.authorLi, W.
dc.contributor.authorWitters, Liesbeth
dc.contributor.authorWalke, Amey
dc.contributor.authorPeng, Lan
dc.contributor.authorRassoul, Nouredine
dc.contributor.authorMatagne, Philippe
dc.contributor.authorJamieson, Geraldine
dc.contributor.authorInoue, Fumihiro
dc.contributor.authorNguyen, B.Y.
dc.contributor.authorDebruyn, Haroen
dc.contributor.authorDevriendt, Katia
dc.contributor.authorTeugels, Lieve
dc.contributor.authorHeylen, Nancy
dc.contributor.authorVecchio, Emma
dc.contributor.authorZheng, T.
dc.contributor.authorRadisic, Dunja
dc.contributor.authorRosseel, Erik
dc.contributor.authorVanherle, Wendy
dc.contributor.authorHikavyy, Andriy
dc.contributor.authorChan, BT
dc.contributor.authorBesnard, G.
dc.contributor.authorSchwarzenbach, W.
dc.contributor.authorGaudin, G.
dc.contributor.authorRadu, Iuliana
dc.contributor.authorWaldron, Niamh
dc.contributor.authorDe Heyn, Vincent
dc.contributor.authorDemuynck, Steven
dc.contributor.authorBoemmels, Juergen
dc.contributor.authorRyckaert, Julien
dc.contributor.authorCollaert, Nadine
dc.contributor.authorMocuta, Dan
dc.date.accessioned2021-10-27T21:50:31Z
dc.date.available2021-10-27T21:50:31Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/34309
dc.sourceIIOimport
dc.titleBuried metal line compatible with 3D sequential integration for top tier planar devices dynamic Vth tuning and RF shielding applications
dc.typeProceedings paper
dc.contributor.imecauthorVandooren, Anne
dc.contributor.imecauthorWu, Zhicheng
dc.contributor.imecauthorKhaled, Ahmad
dc.contributor.imecauthorFranco, Jacopo
dc.contributor.imecauthorParvais, Bertrand
dc.contributor.imecauthorWitters, Liesbeth
dc.contributor.imecauthorWalke, Amey
dc.contributor.imecauthorPeng, Lan
dc.contributor.imecauthorRassoul, Nouredine
dc.contributor.imecauthorMatagne, Philippe
dc.contributor.imecauthorJamieson, Geraldine
dc.contributor.imecauthorInoue, Fumihiro
dc.contributor.imecauthorDebruyn, Haroen
dc.contributor.imecauthorDevriendt, Katia
dc.contributor.imecauthorTeugels, Lieve
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorVecchio, Emma
dc.contributor.imecauthorRadisic, Dunja
dc.contributor.imecauthorRosseel, Erik
dc.contributor.imecauthorVanherle, Wendy
dc.contributor.imecauthorHikavyy, Andriy
dc.contributor.imecauthorChan, BT
dc.contributor.imecauthorRadu, Iuliana
dc.contributor.imecauthorWaldron, Niamh
dc.contributor.imecauthorDe Heyn, Vincent
dc.contributor.imecauthorDemuynck, Steven
dc.contributor.imecauthorBoemmels, Juergen
dc.contributor.imecauthorRyckaert, Julien
dc.contributor.imecauthorCollaert, Nadine
dc.contributor.orcidimecVandooren, Anne::0000-0002-2412-0176
dc.contributor.orcidimecKhaled, Ahmad::0000-0003-2892-3176
dc.contributor.orcidimecFranco, Jacopo::0000-0002-7382-8605
dc.contributor.orcidimecParvais, Bertrand::0000-0003-0769-7069
dc.contributor.orcidimecPeng, Lan::0000-0003-1824-126X
dc.contributor.orcidimecRassoul, Nouredine::0000-0001-9489-3396
dc.contributor.orcidimecJamieson, Geraldine::0000-0002-6750-097X
dc.contributor.orcidimecDevriendt, Katia::0000-0002-0662-7926
dc.contributor.orcidimecTeugels, Lieve::0000-0002-6613-9414
dc.contributor.orcidimecHikavyy, Andriy::0000-0002-8201-075X
dc.contributor.orcidimecChan, BT::0000-0003-2890-0388
dc.contributor.orcidimecRadu, Iuliana::0000-0002-7230-7218
dc.contributor.orcidimecCollaert, Nadine::0000-0002-8062-3165
dc.source.peerreviewyes
dc.source.beginpageT56
dc.source.endpageT57
dc.source.conference2019 Symposia on VLSI Technology and Circuits
dc.source.conferencedate9/06/2019
dc.source.conferencelocationKyoto Japan
imec.availabilityPublished - imec


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