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Comparison of copper electroplating, copper wet etching and linear sweep voltammetry as techniques to investigate the porosity of atomic layer deposited Al2O3

dc.contributor.authorVanhaverbeke, Celine
dc.contributor.authorCauwe, Maarten
dc.contributor.authorStockman, Arno
dc.contributor.authorOp de Beeck, Maaike
dc.contributor.authorDe Smet, Herbert
dc.date.accessioned2021-10-27T21:54:41Z
dc.date.available2021-10-27T21:54:41Z
dc.date.issued2019
dc.identifier.issn0040-6090
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/34315
dc.sourceIIOimport
dc.titleComparison of copper electroplating, copper wet etching and linear sweep voltammetry as techniques to investigate the porosity of atomic layer deposited Al2O3
dc.typeJournal article
dc.contributor.imecauthorCauwe, Maarten
dc.contributor.imecauthorStockman, Arno
dc.contributor.imecauthorOp de Beeck, Maaike
dc.contributor.imecauthorDe Smet, Herbert
dc.contributor.orcidimecCauwe, Maarten::0000-0002-6413-998X
dc.contributor.orcidimecOp de Beeck, Maaike::0000-0002-2700-6432
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage137424
dc.source.journalThin Solid Films
dc.source.volume686
dc.identifier.urlhttps://doi.org/10.1016/j.tsf.2019.137424
imec.availabilityPublished - open access


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