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Comparison of copper electroplating, copper wet etching and linear sweep voltammetry as techniques to investigate the porosity of atomic layer deposited Al2O3
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Comparison of copper electroplating, copper wet etching and linear sweep voltammetry as techniques to investigate the porosity of atomic layer deposited Al2O3
Date
2019
Journal article
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Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Vanhaverbeke, Celine
;
Cauwe, Maarten
;
Stockman, Arno
;
Op de Beeck, Maaike
;
De Smet, Herbert
Journal
Thin Solid Films
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1887
since deposited on 2021-10-27
Acq. date: 2025-10-25
Citations
Metrics
Views
1887
since deposited on 2021-10-27
Acq. date: 2025-10-25
Citations