Comparison of copper electroplating, copper wet etching and linear sweep voltammetry as techniques to investigate the porosity of atomic layer deposited Al2O3

dc.contributor.author	Vanhaverbeke, Celine
dc.contributor.author	Cauwe, Maarten
dc.contributor.author	Stockman, Arno
dc.contributor.author	Op de Beeck, Maaike
dc.contributor.author	De Smet, Herbert
dc.contributor.imecauthor	Cauwe, Maarten
dc.contributor.imecauthor	Stockman, Arno
dc.contributor.imecauthor	Op de Beeck, Maaike
dc.contributor.imecauthor	De Smet, Herbert
dc.contributor.orcidimec	Cauwe, Maarten::0000-0002-6413-998X
dc.contributor.orcidimec	Op de Beeck, Maaike::0000-0002-2700-6432
dc.date.accessioned	2021-10-27T21:54:41Z
dc.date.available	2021-10-27T21:54:41Z
dc.date.embargo	9999-12-31
dc.date.issued	2019
dc.identifier.issn	0040-6090
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/34315
dc.identifier.url	https://doi.org/10.1016/j.tsf.2019.137424
dc.source.beginpage	137424
dc.source.journal	Thin Solid Films
dc.source.volume	686
dc.title	Comparison of copper electroplating, copper wet etching and linear sweep voltammetry as techniques to investigate the porosity of atomic layer deposited Al2O3
dc.type	Journal article
dspace.entity.type	Publication
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