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dc.contributor.authorDonnay, Stephane
dc.contributor.authorVaesen, Kristof
dc.contributor.authorPieters, Philip
dc.contributor.authorDiels, Wim
dc.contributor.authorWambacq, P.
dc.contributor.authorDe Raedt, Walter
dc.contributor.authorBeyne, Eric
dc.contributor.authorEngels, Marc
dc.contributor.authorBolsens, Ivo
dc.date.accessioned2021-10-06T11:06:28Z
dc.date.available2021-10-06T11:06:28Z
dc.date.issued1999
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/3431
dc.sourceIIOimport
dc.titleChip-package co-design of a 4.7 GHz VCO
dc.typeProceedings paper
dc.contributor.imecauthorDonnay, Stephane
dc.contributor.imecauthorVaesen, Kristof
dc.contributor.imecauthorPieters, Philip
dc.contributor.imecauthorDe Raedt, Walter
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVaesen, Kristof::0000-0001-9971-3593
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.beginpage145
dc.source.endpage148
dc.source.conferenceICM'99. The eleventh international conference on microelectronics. Proceedings;
imec.availabilityPublished - imec


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