Show simple item record

Electromigration scaling limits of copper interconnects

dc.contributor.authorVarela Pedreira, Olalla
dc.contributor.authorZahedmanesh, Houman
dc.contributor.authorCiofi, Ivan
dc.contributor.authorTokei, Zsolt
dc.contributor.authorCroes, Kristof
dc.date.accessioned2021-10-27T22:04:19Z
dc.date.available2021-10-27T22:04:19Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/34329
dc.sourceIIOimport
dc.titleElectromigration scaling limits of copper interconnects
dc.typeProceedings paper
dc.contributor.imecauthorVarela Pedreira, Olalla
dc.contributor.imecauthorZahedmanesh, Houman
dc.contributor.imecauthorCiofi, Ivan
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorCroes, Kristof
dc.contributor.orcidimecCiofi, Ivan::0000-0003-1374-4116
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage407
dc.source.endpage408
dc.source.conferenceExtended Abstracts of the 2019 International Conference on Solid State Devices and Materials - SSDM
dc.source.conferencedate2/09/2019
dc.source.conferencelocationNagoya Japan
imec.availabilityPublished - open access


Files in this item

Thumbnail
Name:
43335.pdf
Size:
586.3Kb
Format:
PDF
View/open

This item appears in the following collection(s)

Show simple item record