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First demonstration of a low cost/customizable chip level 3D printed microjet hotspot-targeted cooler for high power applications

dc.contributor.authorWei, Tiwei
dc.contributor.authorOprins, Herman
dc.contributor.authorBeyne, Eric
dc.contributor.authorCherman, Vladimir
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorBaelmans, Martine
dc.date.accessioned2021-10-27T23:19:45Z
dc.date.available2021-10-27T23:19:45Z
dc.date.issued2019-05
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/34427
dc.sourceIIOimport
dc.titleFirst demonstration of a low cost/customizable chip level 3D printed microjet hotspot-targeted cooler for high power applications
dc.typeProceedings paper
dc.contributor.imecauthorWei, Tiwei
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.source.peerreviewyes
dc.source.beginpage126
dc.source.endpage134
dc.source.conferenceIEEE 69th Electronic Components and Technology Conference - ECTC
dc.source.conferencedate28/05/2019
dc.source.conferencelocationLas Vegas, NV USA
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8811393
imec.availabilityPublished - imec


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