Show simple item record

Experimental characterization of a chip level 3D printed microjet liquid impingement cooler for high performance systems

dc.contributor.authorWei, Tiwei
dc.contributor.authorOprins, Herman
dc.contributor.authorCherman, Vladimir
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorBeyne, Eric
dc.contributor.authorYang, Shoufeng
dc.contributor.authorMartine, Baelmans
dc.date.accessioned2021-10-27T23:21:16Z
dc.date.available2021-10-27T23:21:16Z
dc.date.issued2019
dc.identifier.issn2156-3950
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/34429
dc.sourceIIOimport
dc.titleExperimental characterization of a chip level 3D printed microjet liquid impingement cooler for high performance systems
dc.typeJournal article
dc.contributor.imecauthorWei, Tiwei
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.beginpage1815
dc.source.endpage1824
dc.source.journalIEEE Transactions on Components, Packaging and Manufacturing Technology
dc.source.issue9
dc.source.volume9
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8668553
imec.availabilityPublished - imec


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following collection(s)

Show simple item record