Authors

Wei, Tiwei; Oprins, Herman; Cherman, Vladimir; De Wolf, Ingrid; Beyne, Eric; Yang, Shoufeng; Martine, Baelmans

ISSN

2156-3950

Issue

9

Journal

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volume

9

Title

Experimental characterization of a chip level 3D printed microjet liquid impingement cooler for high performance systems

Publication type

Journal article