Experimental characterization of a chip level 3D printed microjet liquid impingement cooler for high performance systems

dc.contributor.author	Wei, Tiwei
dc.contributor.author	Oprins, Herman
dc.contributor.author	Cherman, Vladimir
dc.contributor.author	De Wolf, Ingrid
dc.contributor.author	Beyne, Eric
dc.contributor.author	Yang, Shoufeng
dc.contributor.author	Martine, Baelmans
dc.contributor.imecauthor	Wei, Tiwei
dc.contributor.imecauthor	Oprins, Herman
dc.contributor.imecauthor	Cherman, Vladimir
dc.contributor.imecauthor	De Wolf, Ingrid
dc.contributor.imecauthor	Beyne, Eric
dc.contributor.orcidimec	Oprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimec	De Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimec	Beyne, Eric::0000-0002-3096-050X
dc.date.accessioned	2021-10-27T23:21:16Z
dc.date.available	2021-10-27T23:21:16Z
dc.date.issued	2019
dc.identifier.issn	2156-3950
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/34429
dc.identifier.url	https://ieeexplore.ieee.org/document/8668553
dc.source.beginpage	1815
dc.source.endpage	1824
dc.source.issue	9
dc.source.journal	IEEE Transactions on Components, Packaging and Manufacturing Technology
dc.source.volume	9
dc.title	Experimental characterization of a chip level 3D printed microjet liquid impingement cooler for high performance systems
dc.type	Journal article
dspace.entity.type	Publication
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