Show simple item record

Investigating the electromigration limits of Cu nano-interconnects using a novel hybrid physics-based model

dc.contributor.authorZahedmanesh, Houman
dc.contributor.authorVarela Pedreira, Olalla
dc.contributor.authorTokei, Zsolt
dc.contributor.authorCroes, Kristof
dc.date.accessioned2021-10-28T00:22:28Z
dc.date.available2021-10-28T00:22:28Z
dc.date.issued2019
dc.identifier.issn0021-8979
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/34510
dc.sourceIIOimport
dc.titleInvestigating the electromigration limits of Cu nano-interconnects using a novel hybrid physics-based model
dc.typeJournal article
dc.contributor.imecauthorZahedmanesh, Houman
dc.contributor.imecauthorVarela Pedreira, Olalla
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorCroes, Kristof
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage55102
dc.source.journalJournal of Applied Physics
dc.source.issue5
dc.source.volume126
dc.identifier.urlhttps://doi.org/10.1063/1.5093769
imec.availabilityPublished - open access


Files in this item

Thumbnail
Name:
40819.pdf
Size:
3.140Mb
Format:
PDF
View/open

This item appears in the following collection(s)

Show simple item record