Publication:
Investigating the electromigration limits of Cu nano-interconnects using a novel hybrid physics-based model
Date
Loading...
Files
Journal
Abstract
Description
Statistics
Views
1843 since deposited on 2021-10-28
1last month
Acq. date: 2026-10-13
Citations
Statistics
Views
1843 since deposited on 2021-10-28
1last month
Acq. date: 2026-10-13
Citations