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Investigating the electromigration limits of Cu nano-interconnects using a novel hybrid physics-based model
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Investigating the electromigration limits of Cu nano-interconnects using a novel hybrid physics-based model
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Date
2019
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Zahedmanesh, Houman
;
Varela Pedreira, Olalla
;
Tokei, Zsolt
;
Croes, Kristof
Journal
Journal of Applied Physics
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1840
since deposited on 2021-10-28
Acq. date: 2025-12-16
Citations
Metrics
Views
1840
since deposited on 2021-10-28
Acq. date: 2025-12-16
Citations