Investigating the electromigration limits of Cu nano-interconnects using a novel hybrid physics-based model

dc.contributor.author	Zahedmanesh, Houman
dc.contributor.author	Varela Pedreira, Olalla
dc.contributor.author	Tokei, Zsolt
dc.contributor.author	Croes, Kristof
dc.contributor.imecauthor	Zahedmanesh, Houman
dc.contributor.imecauthor	Varela Pedreira, Olalla
dc.contributor.imecauthor	Tokei, Zsolt
dc.contributor.imecauthor	Croes, Kristof
dc.contributor.orcidimec	Croes, Kristof::0000-0002-3955-0638
dc.date.accessioned	2021-10-28T00:22:28Z
dc.date.available	2021-10-28T00:22:28Z
dc.date.embargo	9999-12-31
dc.date.issued	2019
dc.identifier.issn	0021-8979
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/34510
dc.identifier.url	https://doi.org/10.1063/1.5093769
dc.source.beginpage	55102
dc.source.issue	5
dc.source.journal	Journal of Applied Physics
dc.source.volume	126
dc.title	Investigating the electromigration limits of Cu nano-interconnects using a novel hybrid physics-based model
dc.type	Journal article
dspace.entity.type	Publication
Files	Original bundle Name: 40819.pdf Size: 3.14 MB Format: Adobe Portable Document Format Download
Publication available in collections:	Articles