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Copper electromigration; prediction of scaling limits

dc.contributor.authorZahedmanesh, Houman
dc.contributor.authorVarela Pedreira, Olalla
dc.contributor.authorWilson, Chris
dc.contributor.authorTokei, Zsolt
dc.contributor.authorCroes, Kristof
dc.date.accessioned2021-10-28T00:23:11Z
dc.date.available2021-10-28T00:23:11Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/34511
dc.sourceIIOimport
dc.titleCopper electromigration; prediction of scaling limits
dc.typeProceedings paper
dc.contributor.imecauthorZahedmanesh, Houman
dc.contributor.imecauthorVarela Pedreira, Olalla
dc.contributor.imecauthorWilson, Chris
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorCroes, Kristof
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.source.peerreviewyes
dc.source.beginpage10.3
dc.source.conferenceIEEE International Interconnect Technology Conference (IITC 2019) and Materials for Advanced Metallization Conference (MAM 2019)
dc.source.conferencedate3/06/2019
dc.source.conferencelocationBrussels Belgium
dc.identifier.urlhttps://iitc-conference.org/2019-iitc-mam-program/
imec.availabilityPublished - imec


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