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Low-k materials etch and strip optimization for sub 0.25µm technology

dc.contributor.authorGao, Teng
dc.contributor.authorGray, William
dc.contributor.authorVan Hove, Marleen
dc.contributor.authorRosseel, Erik
dc.contributor.authorStruyf, Herbert
dc.contributor.authorMeynen, Herman
dc.contributor.authorVanhaelemeersch, Serge
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-06T11:11:19Z
dc.date.available2021-10-06T11:11:19Z
dc.date.issued1999
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/3459
dc.sourceIIOimport
dc.titleLow-k materials etch and strip optimization for sub 0.25µm technology
dc.typeProceedings paper
dc.contributor.imecauthorRosseel, Erik
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.imecauthorVanhaelemeersch, Serge
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecVanhaelemeersch, Serge::0000-0003-2102-7395
dc.contributor.orcidimecStruyf, Herbert::0000-0002-6782-5424
dc.source.peerreviewno
dc.source.beginpage53
dc.source.endpage55
dc.source.conferenceProceedings of the International Interconnect Technology Conference - IITC; San Francisco, CA, USA.
imec.availabilityPublished - imec


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