dc.contributor.author | Capuz, Giovanni | |
dc.contributor.author | Lofrano, Melina | |
dc.contributor.author | Gerets, Carine | |
dc.contributor.author | Duval, Fabrice | |
dc.contributor.author | Bex, Pieter | |
dc.contributor.author | Derakhshandeh, Jaber | |
dc.contributor.author | Phommahaxay, Alain | |
dc.contributor.author | Beyne, Eric | |
dc.contributor.author | Miller, Andy | |
dc.contributor.author | Vanstreels, Kris | |
dc.date.accessioned | 2021-10-28T20:32:12Z | |
dc.date.available | 2021-10-28T20:32:12Z | |
dc.date.issued | 2020 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/34838 | |
dc.source | IIOimport | |
dc.title | A novel method for characterization of Ultra Low Viscosity NCF layers using TCB for 3D Assembly | |
dc.type | Meeting abstract | |
dc.contributor.imecauthor | Capuz, Giovanni | |
dc.contributor.imecauthor | Lofrano, Melina | |
dc.contributor.imecauthor | Gerets, Carine | |
dc.contributor.imecauthor | Duval, Fabrice | |
dc.contributor.imecauthor | Bex, Pieter | |
dc.contributor.imecauthor | Derakhshandeh, Jaber | |
dc.contributor.imecauthor | Phommahaxay, Alain | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.imecauthor | Miller, Andy | |
dc.contributor.imecauthor | Vanstreels, Kris | |
dc.contributor.orcidimec | Capuz, Giovanni::0000-0002-5263-4836 | |
dc.contributor.orcidimec | Bex, Pieter::0000-0003-0896-2514 | |
dc.contributor.orcidimec | Derakhshandeh, Jaber::0000-0003-2448-9165 | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.contributor.orcidimec | Vanstreels, Kris::0000-0002-4420-0966 | |
dc.source.peerreview | yes | |
dc.source.conference | IMAPS 53rd International Symposium on Microelectronics | |
dc.source.conferencedate | 6/10/2020 | |
dc.source.conferencelocation | online online | |
imec.availability | Published - imec | |