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dc.contributor.authorCapuz, Giovanni
dc.contributor.authorLofrano, Melina
dc.contributor.authorGerets, Carine
dc.contributor.authorDuval, Fabrice
dc.contributor.authorBex, Pieter
dc.contributor.authorDerakhshandeh, Jaber
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorBeyne, Eric
dc.contributor.authorMiller, Andy
dc.contributor.authorVanstreels, Kris
dc.date.accessioned2021-10-28T20:32:12Z
dc.date.available2021-10-28T20:32:12Z
dc.date.issued2020
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/34838
dc.sourceIIOimport
dc.titleA novel method for characterization of Ultra Low Viscosity NCF layers using TCB for 3D Assembly
dc.typeMeeting abstract
dc.contributor.imecauthorCapuz, Giovanni
dc.contributor.imecauthorLofrano, Melina
dc.contributor.imecauthorGerets, Carine
dc.contributor.imecauthorDuval, Fabrice
dc.contributor.imecauthorBex, Pieter
dc.contributor.imecauthorDerakhshandeh, Jaber
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorVanstreels, Kris
dc.contributor.orcidimecCapuz, Giovanni::0000-0002-5263-4836
dc.contributor.orcidimecBex, Pieter::0000-0003-0896-2514
dc.contributor.orcidimecDerakhshandeh, Jaber::0000-0003-2448-9165
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecVanstreels, Kris::0000-0002-4420-0966
dc.source.peerreviewyes
dc.source.conferenceIMAPS 53rd International Symposium on Microelectronics
dc.source.conferencedate6/10/2020
dc.source.conferencelocationonline online
imec.availabilityPublished - imec


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