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High-density interconnect technology assessment of printed circuit boards for space applications

dc.contributor.authorCauwe, Maarten
dc.contributor.authorVandevelde, Bart
dc.contributor.authorNawghane, Chinmay
dc.contributor.authorVan De Slyeke, Marnix
dc.contributor.authorBosman, Erwin
dc.contributor.authorVerhegge, Joachim
dc.contributor.authorCoulon, Alexia
dc.contributor.authorHeltzel, Stan
dc.date.accessioned2021-10-28T20:37:25Z
dc.date.available2021-10-28T20:37:25Z
dc.date.issued2020
dc.identifier.issn1551-4897
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/34870
dc.sourceIIOimport
dc.titleHigh-density interconnect technology assessment of printed circuit boards for space applications
dc.typeJournal article
dc.contributor.imecauthorCauwe, Maarten
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorNawghane, Chinmay
dc.contributor.orcidimecCauwe, Maarten::0000-0002-6413-998X
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecNawghane, Chinmay::0000-0002-1867-827X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage79
dc.source.endpage88
dc.source.journalJournal of Microelectronics and Electronic Packaging
dc.source.issue3
dc.source.volume17
dc.identifier.urlhttps://doi.org/10.4071/imaps.1212898
imec.availabilityPublished - open access


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