Show simple item record

Thermomechanical challenges for device interconnect and advanced packaging

dc.contributor.authorGonzalez, Mario
dc.date.accessioned2021-10-28T22:01:06Z
dc.date.available2021-10-28T22:01:06Z
dc.date.issued2020
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/35185
dc.sourceIIOimport
dc.titleThermomechanical challenges for device interconnect and advanced packaging
dc.typeOral presentation
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.orcidimecGonzalez, Mario::0000-0003-4374-4854
dc.source.peerreviewno
dc.source.conferenceIEEE International Interconnect Technology Conference (IEEE IITC)
dc.source.conferencedate5/10/2020
dc.source.conferencelocationSan José California USA
imec.availabilityPublished - imec
imec.internalnotesInvited workshop speaker


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following collection(s)

Show simple item record