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Impact of packaging stress on thinned 6T SRAM die

dc.contributor.authorHiblot, Gaspard
dc.contributor.authorLiu, Yefan
dc.contributor.authorVan der Plas, Geert
dc.date.accessioned2021-10-28T22:33:34Z
dc.date.available2021-10-28T22:33:34Z
dc.date.issued2020
dc.identifier.issn2168-1724
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/35273
dc.sourceIIOimport
dc.titleImpact of packaging stress on thinned 6T SRAM die
dc.typeJournal article
dc.contributor.imecauthorHiblot, Gaspard
dc.contributor.imecauthorLiu, Yefan
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.orcidimecHiblot, Gaspard::0000-0002-3869-965X
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.source.peerreviewyes
dc.source.beginpage38
dc.source.endpage45
dc.source.journalInternational Journal of Electronics Letters
dc.source.issue1
dc.source.volume8
dc.identifier.urlhttps://doi.org/10.1080/21681724.2018.1545924
imec.availabilityPublished - imec


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