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Impact of packaging stress on thinned 6T SRAM die
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Authors
Hiblot, Gaspard
;
Liu, Yefan
;
Van der Plas, Geert
ISSN
2168-1724
Issue
1
Journal
International Journal of Electronics Letters
Volume
8
Title
Impact of packaging stress on thinned 6T SRAM die
Publication type
Journal article
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