Publication:
Impact of packaging stress on thinned 6T SRAM die
Date
| dc.contributor.author | Hiblot, Gaspard | |
| dc.contributor.author | Liu, Yefan | |
| dc.contributor.author | Van der Plas, Geert | |
| dc.contributor.imecauthor | Hiblot, Gaspard | |
| dc.contributor.imecauthor | Liu, Yefan | |
| dc.contributor.imecauthor | Van der Plas, Geert | |
| dc.contributor.orcidimec | Hiblot, Gaspard::0000-0002-3869-965X | |
| dc.contributor.orcidimec | Van der Plas, Geert::0000-0002-4975-6672 | |
| dc.date.accessioned | 2021-10-28T22:33:34Z | |
| dc.date.available | 2021-10-28T22:33:34Z | |
| dc.date.issued | 2020 | |
| dc.identifier.issn | 2168-1724 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/35273 | |
| dc.identifier.url | https://doi.org/10.1080/21681724.2018.1545924 | |
| dc.source.beginpage | 38 | |
| dc.source.endpage | 45 | |
| dc.source.issue | 1 | |
| dc.source.journal | International Journal of Electronics Letters | |
| dc.source.volume | 8 | |
| dc.title | Impact of packaging stress on thinned 6T SRAM die | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
| Files | ||
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