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Paths towards ultra high-density interconnect 3D systems: contribution of wafer geometry for achieving sub 200nm wafer-to-wafer bonding overlay

dc.contributor.authorIacovo, Serena
dc.contributor.authorDe Vos, Joeri
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-28T22:45:15Z
dc.date.available2021-10-28T22:45:15Z
dc.date.issued2020
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/35303
dc.sourceIIOimport
dc.titlePaths towards ultra high-density interconnect 3D systems: contribution of wafer geometry for achieving sub 200nm wafer-to-wafer bonding overlay
dc.typeProceedings paper
dc.contributor.imecauthorIacovo, Serena
dc.contributor.imecauthorDe Vos, Joeri
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecIacovo, Serena::0000-0002-0826-9165
dc.contributor.orcidimecDe Vos, Joeri::0000-0002-9332-9336
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.beginpage44
dc.source.conferenceIMAPS 2020 - 16th International Conference and Exhibition on Device Packaging
dc.source.conferencedate2/03/2020
dc.source.conferencelocationScottsdale, AZ USA
dc.identifier.urlhttps://imaps.org/device_packaging_2020_program.php
imec.availabilityPublished - imec


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